Integrated Microwave Assemblies
From baseband to antenna
Complete Subsystem Functionality
The culmination of Nanowave's end-to-end capabilities is realized in the design and manufacture of integrated microwave assemblies (IMA's). Performance goals of IMA's are all about achieving optimum size, weight and power (SWaP) at the targeted cost. Nanowave Technologies delivers thousands of integrated assemblies to major OEMs worldwide that excel in meeting these parameters. Beginning with our customer's specifications we engineer a custom solution, leveraging our extensive design library of component technologies and bare die devices.
Nanowave's IMA production brings all of our integrated technologies together for customer success. Our custom design approach, our vertical integration, automated assembly and test processes deliver IMC products which meet demanding targets of size, weight, power and cost.
The first level of integration beyond components is Up/Down converters. Further integration yields full transceiver functionality, T/R modules, and other subsystem requirements. Using our SSPA and LNA capabilities, our signal source technology, and basic mixer and multiplier technologies, Nanowave delivers frequency conversion products on our MHMIC platform that exceed SWaP (Size, weight and Power) of integrated component solutions. This platform approach assures the best chip level performance can be extracted and provides exceptional levels of subsystem performance to radar and communication systems for military and commercial use.