Nanowave's IMA production brings all of our integrated technologies together for customer success. Our custom design approach, our vertical integration, automated assembly and test processes deliver IMC products which meet demanding targets of size, weight, power and cost.
Die are produced, if necessary, to meet the exacting requirements and then integrated with other die onto MHMIC (Miniature Hybrid Microwave Integrated Circuit) modules using our in-house multilayer thin film technology and our automated die attach and high speed wire bonders. These modules are then integrated into housings machined on our 6-axis Matsurra CNC mills. PC boards are populated and reflowed in-house and married to large laser-welded hermetic enclosures to be tested on our automated performance and environmental test stations. Qualification and verification of environmental characteristics happens on our vibration, shock and thermal test stations.
By using our bare-die MHMIC approach, we extract the highest performance from die level devices while using internally provided low cost thin film circuitry to provide compact inexpensive passive components. Integrating these MHMIC modules into large hermetic housings permits the highest performance from these devices, which reduces device count and power consumption. Hermetic sealing at the assembly level in our custom machined housings provides a single verifiable environmental seal instead of dozens to hundreds required in other integration approaches. Housings are designed to maximize use of available space while minimizing weight and controlling thermal and mechanical properties.
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