Thin film Circuits
World class thin film technology
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Copper fill via. Solid filled via provides thermal management and hermeticity in a single substrate. The technology uses pure copper metal deposited directly into the ceramic vias to provide a robust, hermetic, and reliable connection in thin film substrate. High power devices can be mounted directly on top of the solid filled copper via to enhance thermal and electrical performances. |
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Capped via. Provides hermeticity and eliminates solder and epoxy bleed through |
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Thick copper thin film. Thick copper circuitries up to 60um for high current and high power management |
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Deposited AuSn. Selective deposited AuSn attachment. No AuSn preform required. |
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Air-bridge. Interconnections for fine geometries, Lange couplers, overlay capacitors. |
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Integrated thin film passive circuits. Integration of thin film resistors, spiral inductors, overlay capacitors, air-bridges, filled or through vias on low loss ceramic substrates |
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Multi-layers. Integration of up to 2 inter-layer polyimide dielectric |
