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Thin film Circuits

World class thin film technology

Copper fill via. Solid filled via provides thermal management and hermeticity in a single substrate.

The technology uses pure copper metal deposited directly into the ceramic vias to provide a robust, hermetic, and reliable connection in thin film substrate. High power devices can be mounted directly on top of the solid filled copper via to enhance thermal and electrical performances.

Capped via. Provides hermeticity and eliminates solder and epoxy bleed through

Thick copper thin film. Thick copper circuitries up to 60um for high current and high power management

Deposited AuSn. Selective deposited AuSn attachment. No AuSn preform required.

Air-bridge. Interconnections for fine geometries, Lange couplers, overlay capacitors.

Integrated thin film passive circuits. Integration of thin film resistors, spiral inductors, overlay capacitors, air-bridges, filled or through vias on low loss ceramic substrates

Multi-layers. Integration of up to 2 inter-layer polyimide dielectric

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